THERMAL INTERFACE MATERIAL APPLICATION FOR INTEGRATED CIRCUIT COOLING
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United States of America Patent
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app pub date -
Jan 9, 2013
filing date -
Sep 15, 2010
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Abstract
Techniques provide improved thermal interface material application in an assembly associated with an integrated circuit package. For example, an apparatus comprises an integrated circuit module, a printed circuit board, and a heat transfer device. The integrated circuit module is mounted on a first surface of the printed circuit board. The printed circuit board has at least one thermal interface material application via formed therein in alignment with the integrated circuit module. The heat transfer device is mounted on a second surface of the printed circuit board and is thermally coupled to the integrated circuit module. The second surface of the printed circuit board is opposite to the first surface of the printed circuit board.
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