Adhesive composition and method for manufacturing a laminate using the adhesive composition

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United States of America Patent

PATENT NO 9267058
APP PUB NO 20130118671A1
SERIAL NO

13695516

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Abstract

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Adhesive composition according to the present invention includes an adhesive base agent consisting of a monomer and a polymerization initiator. Adhesion of the adhesive composition changes to take local maximum value, minimum value and a value greater than the local maximum value along with increase of irradiation amount of the electromagnetic wave or particle beam irradiated to the adhesive composition under a predetermined temperature environment. In a method for manufacturing a laminate according to the present invention allows for easy peeling of adherends and a layer of the adhesive composition when adhesion of the adhesive composition takes the minimum value.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATIONIBARAKI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mori, Takuya Ibaraki, JP 103 690
Nagatsuka, Tatsuki Ibaraki, JP 32 288
Okamoto, Miki Ibaraki, JP 9 22
Takeda, Kentarou Ibaraki, JP 62 691

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