POLYIMIDE PRECURSOR COMPOSITION, AND WIRING CIRCUIT BOARD EMPLOYING THE COMPOSITION

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United States of America Patent

APP PUB NO 20130118788A1
SERIAL NO

13609864

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Abstract

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A polyimide precursor composition comprises (A), and at least one of (B) and (C), (B) and (C) being present in a proportion of 30-100 parts by weight based on 100 parts by weight of (A):

    (A) a polyimide precursor comprising:(a1) a unit of formula (1):

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATION1-1-2 SHIMOHOZUMI IBARAKI-SHI OSAKA 567-8680

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hikita, Takami Ibaraki-shi, JP 34 166
Hishiki, Tomoaki Ibaraki-shi, JP 13 28
Sakakura, Takatoshi Ibaraki-shi, JP 15 52

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