Method for chemical planarization and chemical planarization apparatus
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United States of America Patent
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Apr 22, 2014
Grant Date -
May 16, 2013
app pub date -
Mar 16, 2012
filing date -
Nov 14, 2011
priority date (Note) -
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Abstract
According to one embodiment, a method is disclosed for chemical planarization. The method can include forming a surface layer on a to-be-processed film having irregularity. The surface layer binds to or adsorbs onto the to-be-processed film along the irregularity to suppress dissolution of the to-be-processed film. The method can include planarizing the to-be-processed film in a processing solution dissolving the to-be-processed film, by rotating the to-be-processed film and a processing body while the to-be-processed film contacting the processing body via the surface layer, removing the surface layer on convex portions of the irregularity while leaving the surface layer on concave portions of the irregularity and making dissolution degree of the convex portions larger than dissolution degree of the concave portions.
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