BONDING WEDGE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 16, 2013
app pub date -
Nov 2, 2012
filing date -
Nov 4, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A bonding wedge particularly suitable for making wire off-die interconnects includes an aperture opening onto a notch or pocket adjacent to the rear of a foot. The foot includes a heel portion and a toe portion. When the bonding wedge is in use, a wire is fed from feedstock through the aperture and the notch or pocket, and passes beneath the foot and extends beyond the toe. The toe is configured to mitigate upward displacement of the free end of the wire during the bonding process.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully