Thinned finger sensor and associated methods
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United States of America Patent
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-
Mar 3, 2015
Grant Date -
May 16, 2013
app pub date -
Jan 10, 2013
filing date -
Oct 18, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic device may include a housing with a connector member opening therein, electronic circuitry within the housing, and a finger sensor assembly carried by the housing. The finger assembly may include a thinned finger sensing integrated circuit (IC) secured to the housing that has a thickness less than 200 microns. The finger sensor assembly may also include a connector member extending through the connector member opening in the housing and coupling together the thinned finger sensing IC and the electronic circuitry. The thinned finger sensing IC may be adhesively secured to the housing, such as using a pressure sensitive adhesive, and the thinned finger sensing IC may conform to a non-planar surface.
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