Lead frame, semiconductor manufacturing apparatus, and semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8952508
APP PUB NO 20130119526A1
SERIAL NO

13605687

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Abstract

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According to one embodiment, a lead frame includes a die pad having a mounting surface on which a semiconductor chip is mounted, plural leads having inner leads and outer leads, and a connecting member that extends from the die pad to both ends of a plurality of leads and connects the die pad and the plurality leads so that the ends of the inner leads are positioned above of the mounting surface.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBA1-1 SHIBAURA 1-CHOME MINATO-KU TOKYO 1050023 ?1050023

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miyake, Eitaro Hyogo-ken, JP 23 76

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