Anisotropic conductive film composition and semiconductor device bonded by the same

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United States of America Patent

PATENT NO 8872357
APP PUB NO 20130119563A1
SERIAL NO

13670569

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Abstract

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An anisotropic conductive film composition for bonding a semiconductor device, the composition including: a binder system including a urethane resin having a glass transition temperature of about 100° C. or higher, a radical polymerizable compound, an organic peroxide, and conductive particles.

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Patent Owner(s)

Patent OwnerAddress
KUKDO CHEMICAL CO LTD61 GASAN DIGITAL 2-RO GEUMCHEON-GU SEOUL

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Park, Do Hyun Uiwang-si, KR 20 44

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