Housing for a chip arrangement and a method for forming a housing
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United States of America Patent
Stats
-
Apr 1, 2014
Grant Date -
May 16, 2013
app pub date -
Nov 14, 2011
filing date -
Nov 14, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A housing for a chip arrangement is provided, the housing including: a carrier including a first carrier side configured to receive a chip arrangement, a second carrier side and one or more through-holes extending from the first carrier side to the second carrier side; at least one electrical connector inserted through a through-hole, the at least one electrical connector arranged to extend from the second carrier side to the first carrier side; wherein the at least one electrical connector may include: a first portion on the first carrier side; a second portion on the first carrier side, wherein the first portion is configured to extend away from the first carrier side at an angle to the second portion; and a third portion on the second carrier side, wherein the third portion is configured to extend away from the second carrier side at an angle to the second portion.
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