Substrate and electronic device including the substrate
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United States of America Patent
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Mar 24, 2015
Grant Date -
May 16, 2013
app pub date -
Aug 20, 2012
filing date -
Nov 10, 2011
priority date (Note) -
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Abstract
A substrate and an electronic device including the substrate are described. The substrate includes a first surface configured such that a semiconductor package or a semiconductor die is installable thereon, and a second surface facing the first surface, wherein, with respect to a central plane disposed between the first surface and the second surface at equal distances therefrom, a coefficient of thermal expansion in a first portion between the first surface and the central plane is configured to be higher than a coefficient of thermal expansion in a second portion between the second surface and the central plane configured to be. By using the substrate, undesirable overall shape deformation during semiconductor installation may be reduced or relieved.
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