LIGHT EMITTING DIODE PACKAGE
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United States of America Patent
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N/A
Issued Date -
May 16, 2013
app pub date -
Dec 12, 2011
filing date -
Nov 14, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A light emitting diode (LED) package including a transparent substrate, a transparent wiring layer, and at least one LED device is provided. The transparent wiring layer is disposed on the transparent substrate. The LED device is disposed on the transparent substrate and electrically connected to the transparent wiring layer.
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