Bi—Sn based high-temperature solder alloy

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United States of America Patent

PATENT NO 9205513
SERIAL NO

13261554

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Abstract

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A high-temperature solder alloy is a Bi—Sn based solder alloy containing at least 90 mass % of Bi, further containing 1-5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5-5 mass %, and preferably further containing 0.0004-0.01 mass % of P.

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Patent Owner(s)

Patent OwnerAddress
SENJU METAL INDUSTRY CO LTDTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inagawa, Yoshimi Tokyo, JP 1 4
Toyoda, Minoru Tokyo, JP 55 691
Ueshima, Minoru Tokyo, JP 40 315

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