PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET

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United States of America Patent

APP PUB NO 20130122288A1
SERIAL NO

13672938

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Abstract

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Disclosed is a pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive layer having satisfactory tackiness at room temperature and superior reworkability at a low temperature. The pressure-sensitive adhesive composition includes an acrylic polymer formed from a monomer component through polymerization, or a partial polymer of the monomer component. The monomer component includes a (meth)acrylic alkyl ester whose alkyl moiety being a linear or branched-chain alkyl group having 10 to 13 carbon atoms and includes substantially no carboxyl-containing monomer.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATION1-2 SHIMO-HOZUMI 1-CHOME IBARAKI-SHI OSAKA 5678680 ?5678680

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujita, Masato Ibaraki-shi, JP 123 892
Miki, Kaori Ibaraki-shi, JP 12 71
Niwa, Masahito Ibaraki-shi, JP 79 332
Nonaka, Takahiro Ibaraki-shi, JP 77 359

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