PRESSURE-SENSITIVE ADHESIVE SHEET FOR DICING AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING PRESSURE-SENSITIVE ADHESIVE SHEET FOR DICING
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United States of America Patent
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Issued Date -
May 16, 2013
app pub date -
Jul 2, 2012
filing date -
Jul 11, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An object of the present invention is to provide a pressure-sensitive adhesive sheet for dicing that is capable of preventing scratching of an adsorption stage when laser-scribing a semiconductor wafer. Provided is a pressure-sensitive adhesive sheet for dicing having a base and a pressure-sensitive adhesive layer provided on the base, in which 0.02 to 5 parts by weight of an ultraviolet absorber is contained in the pressure-sensitive adhesive layer with respect to 100 parts by weight of resin solid content, and in which the light transmittance at a wavelength of 355 nm of the pressure-sensitive adhesive sheet for dicing is 30% to 80%.
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