Curable composition and process for producing cured film
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United States of America Patent
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Sep 2, 2014
Grant Date -
May 16, 2013
app pub date -
Dec 21, 2012
filing date -
Jun 23, 2010
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Abstract
A curable composition that is sufficiently cured even without a heating step at high temperature and from which a low dielectric constant cured film excellent in solvent resistance is obtained. A curable composition containing a fluorinated polyarylene prepolymer (A) having a crosslinkable functional group, a compound (B) having a number average molecular weight of from 140 to 5,000, having at least two crosslinkable functional groups and having no fluorine atoms, a copolymer (C) having the following units (c1) and (c2) and a radical polymerization initiator (D): unit (c1): a unit having a fluoroalkyl group having at most 20 carbon atoms, which may have an etheric oxygen atom between carbon atoms, and having no crosslinkable functional group; unit (c2): a unit having a crosslinkable functional group.
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