METAL COPPER CLAD LAMINATE AND METHOD OF MANUFACTURING METAL CORE PRINTED CIRCUIT BOARD USING THE SAME
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United States of America Patent
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Issued Date -
May 23, 2013
app pub date -
Nov 19, 2012
filing date -
Nov 18, 2011
priority date (Note) -
Abandoned
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Abstract
There are provided a metal copper clad laminate (MCCL) and a method of manufacturing a metal core printed circuit board (MCPCB) using the same. The MCCL includes a metal plate; a first polyimide adhesive layer laminated on the metal plate, the first polyimide adhesive layer having a shape corresponding to that of the metal plate so as not to expose an upper surface of the metal plate; a polyimide insulating layer laminated on the polyimide adhesive layer; and copper cladding laminated on the polyimide insulating layer.
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