SUBSTRATE PROCESSING APPARATUS
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United States of America Patent
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N/A
Issued Date -
May 23, 2013
app pub date -
Nov 23, 2012
filing date -
Nov 23, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed is a substrate processing apparatus with an improved structure to reduce impurities in a chamber being attached to a substrate during processing of the substrate. The substrate processing apparatus generates plasma to process a substrate and includes a sidewall configured to receive the substrate on a receiving portion surrounded by the sidewall and a dielectric coupled to an upper part of the sidewall configured to hermetically seal the receiving portion, wherein the dielectric includes a shielding portion protruding from a bottom of the dielectric opposite the substrate to an inside of the receiving portion and a curved portion in a region at which the bottom and the shielding portion are connected to each other.
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