Thermal compress bonding
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United States of America Patent
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Oct 15, 2013
Grant Date -
May 23, 2013
app pub date -
Jan 15, 2013
filing date -
Jul 22, 2010
priority date (Note) -
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Abstract
A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together.
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