III-V compound semiconductor epitaxy from a non-III-V substrate

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United States of America Patent

PATENT NO 8686474
APP PUB NO 20130126946A1
SERIAL NO

13740733

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Abstract

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A structure comprises a substrate, a mask, a buffer/nucleation layer, and a group III-V compound semiconductor material. The substrate has a top surface and has a recess from the top surface. The recess includes a sidewall. The first mask is the top surface of the substrate. The buffer/nucleation layer is along the sidewall, and has a different material composition than a material composition of the sidewall. The III-V compound semiconductor material continuously extends from inside the recess on the buffer/nucleation layer to over the first mask.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Ding-Yuan Taichung, TW 64 636
Chiou, Wen-Chih Miaoli, TW 414 9438
Yu, Chen-Hua Hsin-Chu, TW 2207 47923
Yu, Chia-Lin Sigang Township, TW 46 477

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