Microstructure device with an improved anchor

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United States of America Patent

PATENT NO 8704317
APP PUB NO 20130126989A1
SERIAL NO

13721734

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Abstract

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A microelectromechanical system (MEMS) device includes a substrate and an oxide layer formed on the substrate. A cavity is etched in the oxide layer. A microstructure device layer is bonded to the oxide layer, over the cavity. The microstructure device layer includes a substantially solid microstructure MEMS device formed in the microstructure device layer and suspended over a portion of the cavity. An anchor is formed in the device layer and configured to support the microstructure device, the anchor having an undercut in the oxide layer. The undercut has a length along the anchor that is less than one-half a length of an outer boundary dimension of the microstructure MEMS device.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Chun-Wen Zhubei, TW 259 3778
Chu, Chia-Hua Zhubei, TW 192 2736
Lin, Chung-Hsien Hsinchu, TW 82 1467
Tsai, Yi Heng Hsinchu, TW 31 272

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