Image Sensor Module Package and Manufacturing Method Thereof
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United States of America Patent
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Issued Date -
May 23, 2013
app pub date -
Jun 1, 2012
filing date -
Nov 23, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An image sensor module includes a substrate, a circuit layer, a flip chip, an insulating layer, and a conducting layer. The substrate has at least one transparent area and defines a first surface and a second surface. The circuit layer is provided on the first surface of the substrate. The flip chip is connected to the circuit layer. The insulating layer substantially encases the flip chip and a part of the circuit layer, wherein the insulating layer has at least one groove at a lateral side of said insulating layer thereof each provided with a metal layer. The conducting layer is provided on a top surface of the insulating layer, wherein the conducting layer is electrically connected to the circuit layer via the metal layer.
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