EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME

United States of America Patent

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Issued Date
May 23, 2013
app pub date
Sep 13, 2012
filing date
Nov 18, 2011

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Abstract

The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (F): (A) an epoxy resin; (B) a phenol resin; (C) a curing accelerator; (D) an inorganic filler; (E) a hydrotalcite compound; and (F) a carboxyl group-containing wax having an acid value of 10 to 100 mg KOH/g.

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Patent Owner	Address
NITTO DENKO CORPORATION	1-1-2 SHIMOHOZUMI IBARAKI-SHI OSAKA 5678680 ?5678680

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Inventor Name	Address	# of filed Patents	Total Citations
ICHIKAWA, Tomoaki	Osaka, JP	49	145
IWASHIGE, Tomohito	Osaka, JP	15	34
SUGIMOTO, Naoya	Osaka, JP	85	420
YANO, Satomi	Osaka, JP	1	4

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EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

13613269

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13613269

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