Insert for semiconductor package and testing apparatus with the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9024649
APP PUB NO 20130127484A1
SERIAL NO

13587407

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Abstract

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An insert for a semiconductor package testing apparatus comprises a body having a pocket constructed and arranged to receive the semiconductor package, and a sliding tool slidingly positioned on the body. The sliding tool is constructed and arranged to open and close the pocket as a result of a sliding motion of the sliding tool relative to the body.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677 16677

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Guiheum Chungcheongnam-do, KR 2 2
Kang, Minsu Asan-si, KR 8 7
Lee, Seunghee Cheonam-si, KR 71 296
Um, Teaseog Asan-si, KR 3 18

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