GLASS-ENCAPSULATED PRESSURE SENSOR
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United States of America Patent
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Issued Date -
May 23, 2013
app pub date -
Nov 18, 2011
filing date -
Nov 18, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
This disclosure provides systems, methods and apparatus for glass-encapsulated pressure sensors. In one aspect, a glass-encapsulated pressure sensor may include a glass substrate, an electromechanical pressure sensor, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, glass frit, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may partially define a port for the electromechanical pressure sensor at an edge of the glass-encapsulated pressure sensor. In some configurations, the cover glass may form a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical pressure sensor.
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