Lithography method and apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9310700
APP PUB NO 20130128246A1
SERIAL NO

13810384

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

In an embodiment, a lithography method is disclosed that includes providing a providing a first heat load to a first area of an object, and providing a second heat load to a second area of the object, wherein the second heat load is configured to ensure a deformation of the first area of the object caused by providing both the first heat load and the second heat load is smaller than a deformation of the first area of the object caused by providing only the first heat load.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
ASML NETHERLANDS B VPO BOX 324 VELDHOVEN 5500 AH

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koevoets, Adrianus Hendrik Mierlo, NL 29 112
Renkens, Michael Jozef Mathijs Sittard, NL 20 299
Wuister, Sander Frederik Eindhoven, NL 98 1240

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 12, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00