Forming low stress joints using thermal compress bonding
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United States of America Patent
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Dec 31, 2013
Grant Date -
May 23, 2013
app pub date -
Dec 28, 2012
filing date -
Jul 22, 2010
priority date (Note) -
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Abstract
A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer.
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