Substrate conveyance method and substrate conveyance system
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United States of America Patent
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May 6, 2014
Grant Date -
May 23, 2013
app pub date -
Jul 25, 2011
filing date -
Jul 27, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed are a substrate conveyance method and substrate conveyance system that are able to quickly transfer a substrate without losing positional accuracy. Using an electrostatic chuck mechanism in the holding of a wafer (W) by the holding surface (210) of a conveyance robot, the wafer (W) is transferred from a supporting surface (303) to the holding surface (210) in the state where an electrostatic attraction force is generated at the holding surface (210). As a result, since it is possible to hold the wafer by means of the electrostatic attraction force starting immediately after the wafer (W) has been transferred to the holding surface (210), it is possible to rapidly execute a wafer (W) conveying operation and thus it is possible to reduce the conveying time of the wafer between processing chambers.
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