Apparatus and Method for Controlling Wafer Temperature

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United States of America Patent

APP PUB NO 20130130184A1
SERIAL NO

13301501

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Abstract

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A wafer temperature control apparatus comprises a first temperature sensor and a second temperature sensor. The first temperature sensor is configured to receive a first temperature signal from a center portion of a backside of a susceptor. The second temperature sensor is configured to receive a second temperature signal from an edge portion of the susceptor. A plurality of controllers are configured to adjust each heating source's output based upon the first temperature signal and the second temperature signal.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Tai-Chun Hsin-Chu, TW 170 1430
Lee, Tze-Liang Hsin-Chu, TW 403 4505
Li, Jr-Hung Chupei City, TW 83 264
Lin, Yi-Hung Taipei, TW 156 824
Lu, Chang-Shen New Taipei City, TW 5 75
Tsai, Pang-Yen Jhu-Bei City, TW 111 793

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