Method for metal correlated via split for double patterning
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United States of America Patent
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Jun 24, 2014
Grant Date -
May 23, 2013
app pub date -
Jan 16, 2013
filing date -
Nov 30, 2010
priority date (Note) -
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Abstract
A method of via patterning mask assignment for a via layer using double patterning technology, the method includes determining, using a processor, if a via of the via layer intercepts an underlying or overlaying metal structure assigned to a first metal mask. If the via intercepts the metal structure assigned to the first metal mask, assigning the via to a first via mask, wherein the first via mask aligns with the first metal mask. Otherwise, assigning the via to a second via mask, wherein the second via mask aligns with a second metal mask different from the first metal mask.
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