Semiconductor chips having guard rings and methods of fabricating the same
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United States of America Patent
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Jan 7, 2014
Grant Date -
May 23, 2013
app pub date -
Jan 15, 2013
filing date -
Sep 4, 2009
priority date (Note) -
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Abstract
Provided is a semiconductor chip. The semiconductor chip includes a semiconductor substrate including a main chip region and a scribe lane region surrounding the main chip region. An insulating layer is disposed over the semiconductor substrate. A guard ring is disposed in the insulating layer in the scribe lane region. The guard ring surrounds at least a portion of the main chip region. The guard ring has a brittleness greater than a brittleness of the insulating layer.
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