Electrical connector having impedance matched intermediate connection points
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United States of America Patent
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Nov 26, 2013
Grant Date -
May 23, 2013
app pub date -
Nov 17, 2011
filing date -
Nov 17, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
An electrical wafer for electrically connecting to a printed circuit board. The electrical wafer includes an insulative housing and at least one signal conductor disposed in the insulative housing. The at least one signal conductor includes an intermediate portion having a connection point. The connection point includes first and second ends, at least one of which has a width greater than a portion of the at least one signal conductor outside the connection point. The insulative housing has at least one aperture exposing at least a portion of the connection point. A portion of the connection point may be punched out, and a passive circuit element may be placed within the at least one aperture and mounted to the connection point. Multiple electrical wafers may be coupled together by a stiffener and connected to a backplane connector.
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