Thermally driven workload scheduling in a heterogeneous multi-processor system on a chip
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United States of America Patent
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Sep 13, 2016
Grant Date -
May 23, 2013
app pub date -
Jan 25, 2012
filing date -
Nov 21, 2011
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Abstract
Various embodiments of methods and systems for thermally aware scheduling of workloads in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, and because more than one of the processing components may be capable of processing a given block of code, thermally aware workload scheduling techniques that compare performance curves of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by allocating workloads in real time, or near real time, to the processing components best positioned to efficiently process the block of code.
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