Wafer debonding and cleaning apparatus and method of use

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United States of America Patent

PATENT NO 9390949
APP PUB NO 20130133688A1
SERIAL NO

13306625

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Abstract

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This description relates to a wafer debonding and cleaning apparatus including an automatic wafer handling module. The automatic wafer handling module loads a semiconductor wafer into a wafer debonding module for a debonding process. The automatic wafer handling module removes the semiconductor wafer from the debonding module and loads the semiconductor wafer into a wafer cleaning module for a cleaning process.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiou, Wen-Chih Miaoli, TW 414 9438
Lin, Yu-Liang Hsinchu, TW 64 243
Tu, Hung-Jung Hualien, TW 32 474

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