METHOD FOR FORMING INTERCONNECT IN SOLAR CELL
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 30, 2013
app pub date -
Nov 30, 2011
filing date -
Nov 30, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A thin film solar cell and process for forming the same. The solar cell includes a bottom electrode, semiconductor light absorbing layer, and top electrode. Interconnects may be formed between the top and bottom electrodes by electrochemical plating of conductive materials in recessed regions formed between the electrodes. In some embodiments, the conductive materials may be optically opaque metals having non-light transmissive properties. The interconnects are highly conductive and minimize the thickness of the top electrode layer, thereby enhancing light transmission and cell energy conversion performance.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully