Power MOSFETs and methods for forming the same

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United States of America Patent

PATENT NO 8664718
SERIAL NO

13348463

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Abstract

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A power MOSFET includes a semiconductor region extending from a top surface of a semiconductor substrate into the semiconductor substrate, wherein the semiconductor region is of a first conductivity type. A gate dielectric and a gate electrode are disposed over the semiconductor region. A drift region of a second conductivity type opposite the first conductivity type extends from the top surface of the semiconductor substrate into the semiconductor substrate. A dielectric layer has a portion over and in contact with a top surface of the drift region. A conductive field plate is over the dielectric layer. A source region and a drain region are on opposite sides of the gate electrode. The drain region is in contact with the first drift region. A bottom metal layer is over the field plate.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Chih-Chang Hsin-Chu, TW 82 419
Chu, Fu-Yu Hsin-Chu, TW 32 136
Liu, Ruey-Hsin Hsin-Chu, TW 179 1225
Tuan, Hsiao-Chin JuDong Township, TW 57 583

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