Energy harvesting in integrated circuit packages
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United States of America Patent
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Dec 10, 2013
Grant Date -
May 30, 2013
app pub date -
Nov 28, 2011
filing date -
Nov 28, 2011
priority date (Note) -
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Abstract
An energy harvesting integrated circuit (IC) includes electrical connectors, each having a portion of a first material and a portion of a second material. The first and the second materials have a thermoelectric potential. The IC includes a trace of the first material coupled to the first material of each electrical connector, and a trace of the second material coupled to the second material of each electrical connector and the first trace. A portion of the second trace extends away from a portion of the first trace. The IC has charge storing elements coupled to the first and/or second traces. The first material and the second material are heated to create an electron flow from a thermal gradient between a first zone of the heated first and second materials and a second zone of the first and the second materials away from the first zone.
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