Semiconductor structure comprising moisture barrier and conductive redistribution layer
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United States of America Patent
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Sep 17, 2013
Grant Date -
May 30, 2013
app pub date -
Nov 29, 2011
filing date -
Nov 29, 2011
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Abstract
A semiconductor structure includes semiconductor devices on a substrate, a moisture barrier on the substrate surrounding the semiconductor devices, and a metal conductive redistribution layer formed over the moisture barrier. The metal conductive redistribution layer and the moisture barrier define a closed compartment containing the semiconductor devices.
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