Electrical connection structure
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United States of America Patent
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Jul 2, 2013
Grant Date -
May 30, 2013
app pub date -
Nov 30, 2011
filing date -
Nov 30, 2011
priority date (Note) -
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Abstract
A structure comprises a top metal connector formed underneath a bond pad. The bond pad is enclosed by a first passivation layer and a second passivation layer. A polymer layer is further formed on the second passivation layer. The dimension of an opening in the first passivation layer is less than the dimension of the top metal connector. The dimension of the top metal connector is less than the dimensions of an opening in the second passivation layer and an opening in the polymer layer.
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