Bump structures for multi-chip packaging

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United States of America Patent

PATENT NO 8779588
SERIAL NO

13427753

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Abstract

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The mechanisms for forming a multi-chip package described enable chips with different bump sizes being packaged to a common substrate. A chip with larger bumps can be bonded with two or more smaller bumps on a substrate. Conversely, two or more small bumps on a chip may be bonded with a large bump on a substrate. By allowing bumps with different sizes to be bonded together, chips with different bump sizes can be packaged together to form a multi-chip package.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Jing-Cheng Chu Tung Zhen, TW 575 17188
Yu, Chen-Hua Hsinchu, TW 2207 47923

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