Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure
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United States of America Patent
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Jul 22, 2014
Grant Date -
May 30, 2013
app pub date -
Nov 15, 2012
filing date -
Nov 30, 2011
priority date (Note) -
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Abstract
The electronic device includes a terminal structure and a printed circuit board including the terminal structure. The terminal structure includes a solder-joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer. The intermediate layer includes an intermetallic compound including tin and at least one of copper and nickel as principal components. When the indentation elastic modulus of the conductor region is E1 and the indentation elastic modulus of the intermediate layer is E2, the ratio of E1 to E2 is equal to or more than 0.8 and equal to or less than 1.5.
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