Optical component
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United States of America Patent
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May 13, 2014
Grant Date -
May 30, 2013
app pub date -
Aug 2, 2011
filing date -
Aug 6, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In an optical component configured to fix to a mount an optical device chip in which waveguide type optical devices having different thermal expansion coefficients are butt-jointed, deterioration in reliability due to thermal stress is suppressed. The optical component (300) comprises an optical device chip (310) including an LN waveguide (311), a first PLC waveguide (312), a second PLC waveguide (313), and a fiber alignment member (314), a mount (320), and optical fibers (330). Each of connection faces between the first PLC waveguide and the fiber alignment member is configured as an tilted structure, and each of connection faces between the LN waveguide, and the first and second PLC waveguides is configured as a right-angled structure. In the right-angled structure, the connection faces are connected by an adhesive having a lower Young's modulus than that of an adhesive used on the connection faces of the tilted structure.
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