Method for stacking semiconductor dies
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 14, 2014
Grant Date -
May 30, 2013
app pub date -
Jan 23, 2013
filing date -
Dec 8, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A system and method for stacking semiconductor dies is disclosed. A preferred embodiment comprises forming through-silicon vias through the wafer, protecting a rim edge of the wafer, and then removing the unprotected portions so that the rim edge has a greater thickness than the thinned wafer. This thickness helps the fragile wafer survive further transport and process steps. The rim edge is then preferably removed during singulation of the individual dies from the wafer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully