Manufacturing techniques to limit damage on workpiece with varying topographies
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United States of America Patent
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Jan 7, 2014
Grant Date -
May 30, 2013
app pub date -
Nov 29, 2011
filing date -
Nov 29, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
Some embodiments relate to a method for processing a workpiece. In the method, a first photoresist layer is provided over the workpiece, wherein the first photoresist layer has a first photoresist tone. The first photoresist layer is patterned to provide a first opening exposing a first portion of the workpiece. A second photoresist layer is then provided over the patterned first photoresist layer, wherein the second photoresist layer has a second photoresist tone opposite the first photoresist tone. The second photoresist layer is then patterned to provide a second opening that at least partially overlaps the first opening to define a coincidentally exposed workpiece region. A treatment is then performed on the coincidentally exposed workpiece region. Other embodiments are also disclosed.
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