MEMS device etch stop

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8633554
APP PUB NO 20130140653A1
SERIAL NO

13757323

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Abstract

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The present disclosure provides a micro-electro-mechanical systems (MEMS) device and a method for fabricating such a device. In an embodiment, a MEMS device includes a substrate, a dielectric layer above the substrate, an etch stop layer above the dielectric layer, and two anchor plugs above the dielectric layer, the two anchor plugs each contacting the etch stop layer or a top metal layer disposed above the dielectric layer. The device further comprises a MEMS structure layer disposed above a cavity formed between the two anchor plugs and above the etch stop layer from release of a sacrificial layer.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD ("TSMC")NO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU 300-77

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Kuei-Sung Kaohsiung, TW 97 622
Chu, Chia-Hua Zhubei, TW 192 2736
Chu, Li-Cheng Taipei, TW 20 111
Liang, Kai-Chih Zhubei, TW 28 404
Lin, Chung-Hsien Hsinchu, TW 82 1467
Shu, Chia-Pao Hsinchu, TW 13 202
Tsai, Yi Heng Hsinchu, TW 31 272
Yang, Hsueh-An Taipei, TW 18 155

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