Interposer wafer bonding method and apparatus
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United States of America Patent
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Oct 15, 2013
Grant Date -
Jun 6, 2013
app pub date -
Dec 1, 2011
filing date -
Dec 1, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure relates to a method for fast and precise alignment and mounting of a top die onto an interposer wafer. The method is performed by applying a hydrophobic self assembled monolayer to a carrier wafer in a pattern defining a top die placement region correlating to an arrangement of a top die on an interposer wafer. A liquid is provided into the top die placement region and a top die is placed into contact with the liquid. The surface tension of the liquid automatically aligns the top die by generating a force causing the top die to overlap with the top die placement region. The liquid is then eliminated and the top die is affixed to the carrier wafer. The carrier wafer is bonded to the interposer wafer, bringing the top die into contact with an interposer.
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