PROCESS FOR THE ELECTROLESS COPPER PLATING OF METALLIC SUBSTRATES
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United States of America Patent
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Jun 6, 2013
app pub date -
Aug 10, 2011
filing date -
Aug 17, 2010
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Abstract
The invention relates to a process for treating a metallic surface of an object with an aqueous copper-plating solution, with which a first copper-plating solution, which is free of cyanide and free of strong reducing agent, is electrolessly applied to clean metallic surfaces of the object, or after pretreatment to cleaned metallic surfaces, to form a first copper layer or copper alloy layer as a barrier layer and/or as a conductive layer, and also to the use of the objects produced by the process according to the invention.
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