Slurry supply system for CMP process
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United States of America Patent
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Mar 31, 2015
Grant Date -
Jun 6, 2013
app pub date -
Dec 1, 2011
filing date -
Dec 1, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure relates to a slurry distribution system having a distribution tube connected between a mixing tank and a CMP tool. The mixing tank is configured to generate a polishing mixture comprising a diluted slurry having abrasive particles that enable mechanical polishing of a workpiece. The polishing mixture is transported between the mixing tank and a CMP tool by way of a transport piping. An energy source, in communication with the transport piping, transfers energy to the abrasive particles within the polishing mixture, thereby preventing accumulation of the abrasive particles within the transport piping.
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