Method of manufacturing liquid ejecting head, method of manufacturing liquid ejecting apparatus and method of manufacturing piezoelectric element
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United States of America Patent
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Mar 31, 2015
Grant Date -
Jun 13, 2013
app pub date -
Dec 6, 2012
filing date -
Dec 8, 2011
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Abstract
A method of manufacturing a liquid ejecting head includes forming a first electrode made of platinum, forming a buffer layer made of a compound having a pyrochlore structure that contains bismuth or platinum on the first electrode, forming an oxide layer made of an oxide containing bismuth on the buffer layer, forming a piezoelectric layer made of a compound having a perovskite structure that contains bismuth by burning the oxide layer, and forming a second electrode on the piezoelectric layer.
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