Adaptive endpoint method for pad life effect on chemical mechanical polishing
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United States of America Patent
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May 10, 2016
Grant Date -
Jun 13, 2013
app pub date -
Feb 4, 2013
filing date -
Mar 10, 2011
priority date (Note) -
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Abstract
The present disclosure provides a chemical mechanical polishing (CMP) system. The CMP system includes a pad designed for wafer polishing, a motor driver coupled with the pad and designed to drive the pad during the wafer polishing, and a controller coupled with the motor driver and designed to control the motor driver. The CMP system further includes an in-situ rate monitor designed to collect polishing data from a wafer on the pad, determine CMP endpoint based on a life stage of the pad, and provide the CMP endpoint to the controller.
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