Integrated Reflow and Cleaning Process and Apparatus for Performing the Same
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United States of America Patent
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app pub date -
Dec 7, 2011
filing date -
Dec 7, 2011
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Abandoned
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Abstract
A method includes reflowing a solder region of a package structure, and performing a cleaning on the package structure at a cleaning temperature higher than a room temperature. Between the step of reflowing and the step of cleaning, the package structure is not cooled to temperatures close to the room temperature.
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